|
|
 |
|
Feature |
Condltion |
Current |
2008 |
|
Structure |
Layer Count |
Maximum |
32 |
32 |
|
Board Thickness |
Minumum |
14mil |
14mil |
|
Sequential Lamination |
Maximum |
120mil |
120mil |
|
Sequential Build Up |
|
3×IVH |
3×IVH |
|
Capped PTH |
|
3+N+3 |
3+N+3 |
|
Via In Pad |
Filled by Cu paste |
Yes |
Yes |
|
Laser Via Filling |
Filled by Cu paste |
Yes |
Yes |
|
Filled by plating |
No |
Yes |
|
Cavity Formation |
|
Yes |
Yes |
|
Hybird |
FR4+RCC |
Yes |
Yes |
|
FR4+Aramid |
Yes |
Yes |
|
FR4+Getek |
Yes |
Yes |
|
FR4+Rogers |
Yes |
Yes |
|
FR4+PTFE |
Yes |
Yes |
|
Rigid/Flex |
|
Yes |
Yes |
|
Material |
Base Material |
FR4(Tg 140 ℃) |
Yes |
Yes |
|
FR4(Tg 170 ℃) |
Yes |
Yes |
|
Getek |
Yes |
Yes |
|
BT |
Yes |
Yes |
|
Low CTE |
Yes |
Yes |
|
Low Dk.Df |
Yes |
Yes |
|
PTFE |
Yes |
Yes |
|
Rogers |
Yes |
Yes |
|
Halogen Free |
Yes |
Yes |
|
Lead Free |
Yes |
Yes |
|
Kapton(Polyimide) |
Yes |
Yes |
|
Build Up Material |
RCC |
Yes |
Yes |
|
TCD |
Yes |
Yes |
|
Aramid |
Yes |
Yes |
|
FR4 |
Yes |
Yes |
|
Copper Foil(Outer later) |
Minumum |
1/3 OZ |
1/8 OZ |
|
Maximum |
2 OZ |
8 OZ |
|
Copper Foil(Inner later) |
Minumum |
1/2 OZ |
1/3 OZ |
|
Maximum |
2 OZ |
5 OZ |
|
Feature |
Condltion |
Current |
2008 |
|
Dlelectric
Thickness |
Core thickness |
Minimum |
4 Mil |
3 Mil |
|
Dlelectric Thickness
(Prepreg) |
Minimum |
2 Mil |
2 Mil |
|
IVH Thickness |
Minimum |
4 Mil |
3 Mil |
|
Maximum |
80 Mil |
100 Mil |
|
SBU Thickness |
Minimum |
2 Mil |
1.5 Mil |
|
Maximum |
5 Mil |
5 Mil |
|
Dimension
Toierance |
Borad Thickness |
THK < 20 mil |
+/- 2 Mil |
+/- 2 Mil |
|
THK > 20 mil |
+/- 10% |
+/- 10% |
|
Bow & Twist |
THK < 20 mil |
0.70% |
0.70% |
|
THK > 20 mil |
0.70% |
0.50% |
|
Fiduial to Fiduial |
|
+/- 2 Mil |
+/- 1.5 Mil |
|
Hole to Hole |
|
+/- 3 Mil |
+/- 3 Mil |
|
Hole to Edge |
|
+/- 5 Mil |
+/- 5 Mil |
|
Edge to Edge |
|
+/- 5 Mil |
+/- 5 Mil |
|
Registration
Capability
|
Layer to Layer |
|
4 Mil |
3 Mil |
|
Hole Wall to Conductor |
|
7 Mil |
6 Mil |
|
Hole Formation |
Mechanical Hole |
Minimum |
8 Mil |
6 Mil |
|
IVH Hole Size |
Maximum |
16 Mil |
16 Mil |
|
Layer Hole Size |
Minimum |
3 Mil |
3 Mil |
|
Maximum |
8 Mil |
8 Mil |
|
Pad Size(Mechanical Hole) |
Inner Layer |
drill size+8 mil |
drill size+8 mil |
|
Outer Layer |
drill size+8 mil |
drill size+6 mil |
|
Inner Layer Clearance |
drill size+14 mil |
drill size+12 mil |
|
Pad Size(Layer Hole) |
|
drill size+8 mil |
drill size+8 mil |
|
Hole Location Tolerance |
|
+/- 3 Mil |
+/- 3 Mil |
|
Electrical/RF
Capability |
Min Line Width Spacing |
Inner Layer (1/2 OZ) |
2/3 Mil |
2/2 Mil |
|
Inner Layer (1 OZ) |
3/3 Mil |
3/3 Mil |
|
Outer Layer |
3/4 Mil |
3/3 Mil |
|
Impedance Control |
3 Mil Line Width |
10% |
10% |
|
4 Mil Line Width |
8% |
8% |
|
5 Mil Line Width |
7% |
7% |
|
Feature |
Condltion |
Current |
2008 |
|
Plating Cabiligy |
Aspect Ratio
(Depth:Diameter) |
Mechanical Throuch
Hole |
10:0.1 |
15:0.1 |
|
Solder Mask |
Minimum S/M Dam |
Laser Bilnd via |
0.7:1 |
0.1:0.1 |
|
Minimum S/M Opening |
Minimum |
3 mil |
3 mil |
|
Surface Finish |
Organic Solderability
Preservative(OSP) |
Minimum |
2 mil |
1.5 mil |
|
Electroless Nickel /Immersiog Gold(ENLG)
|
|
Yes |
Yes |
|
Selective OSP/ENIG |
|
Yes |
Yes |
|
Hot Air Solder Leveling
(HASL) |
|
Yes |
Yes |
|
Immersiog Silver |
|
Yes |
Yes |
|
Immersiog Tin |
|
Yes |
Yes |
|
Carbon Ink |
|
Yes |
Yes |
|
Electric Test
Cabiligy |
BGA Pitch |
Minimum |
Yes |
Yes |
|
Connertor Pitch |
Minimum |
16 mil |
16 mil |
|
Pad Size |
Minimum |
8 mil |
16 mil |
|
CPK |
Board Thickness |
|
8 mil |
16 mil |
|
Dimension |
Etch Feature to Ecth Feature
|
1 |
1.33 |
|
Ecth Feature to hole |
1 |
1.33 |
|
Hole to Hole |
1 |
1.33 |
|
Hole to Edge |
1 |
1.33 |
|
Edge to Edge |
1 |
1.33 |
|
Impedance |
|
1 |
1.33 |
|
Embedded Passive |
Embedded Capacitor |
Polymer Thick film
|
1 |
1.33 |
|
Flexible Thin fim |
Normal Dk |
No |
Yes |
|
High Dk |
No |
Yes |
|
No |
Yes |
|
Embedded Resistor |
Polymer Thick film |
Widh laser trim |
No |
No |
|
w/o laser trim |
No |
Yes |
|
Metal film |
250ohm/sq &under |
No |
Yes |
|
500ohm/sq &above |
No |
Yes | |
|
|
|
